![]() When used on boards containing a mix of SMT and plated through-hole (PTH) components, through-hole reflow, when achievable by specifically modified paste stencils, may allow for the wave soldering step to be eliminated from the assembly process, potentially reducing assembly costs. Wave soldering however, has been the common method of soldering multi-leaded through-hole components onto a circuit board designed for surface-mount components. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (mainly for prototyping) by soldering individual joints with a hot air pencil. The solder paste reflows in a molten state, creating permanent solder joints. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. Example of reflow soldering thermal profile. ![]()
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